The process of creating semiconductor microchips goes far beyond the engineers who design the part, but also the production of substrates, the silicon ingots and wafers, the wafer processing machinery, and the packaging of the device itself (encapsulation) and the packaging to protect, carry and store the finished device so that it can be safely placed on circuit boards. The supporting careers for all of these steps are immense, are world wide, and everyone plays a critical role! If one step is excluded on one component in one subsystem, no smartphones, automobiles or computers could be created.
Circuit Board Assembly Process
The real SOIC and SOT go through a Surface Mount Assembly process.
Function specific microchips are assembled on Printed Circuit Boards (PCB) to create high level systems like smartphones and computers.